Oct 8 : GlobalFoundries on Thursday said it has reached a $2 billion agreement to make a key component used to link AI processors and memory chips for TSMC at its New York facility.
Known as a silicon interposer, the component sits beneath processors and memory chips inside advanced AI packages and enables them to communicate at high speeds.
• Under the five-year agreement, GlobalFoundries will expand manufacturing capacity at its Malta, New York, facility to produce the components for TSMC
• The Malta facility is expected to become the first US-based source of silicon interposers used in advanced chip-packaging technologies, the company said
Guess WordCrack the word, one row at a timeBuzzwordCreate words using the given lettersMini SudokuTiny puzzle, mighty brain teaserMini CrosswordSmall grid, big challengeWord SearchSpot as many words as you can Show More Show Less• Shares of GlobalFoundries were up about 4 per cent in premarket trading
• The deal provides a framework for future capacity expansion as demand for advanced packaging grows, with volume production expected to begin ramping up in the first half of 2028
• Advanced packaging has become a major constraint on AI chip production, as demand for the technology exceeds available manufacturing capacity